Display device

ABSTRACT

A display device includes a substrate including a display area and a peripheral area and being flexible around a bending axis in the peripheral area, a data line and a driving voltage line in the display area, an inorganic insulating layer defines an opening corresponding to the flexible area, a first and second conductive layers in the peripheral area and being spaced apart from each other around the opening, an organic insulating layer covering the first and second conductive layers, and a connection conductive layer connecting the first and second conductive layers via contact holes of the organic insulating layer, and the first and second conductive layers includes a same material as that of one of the data line and the driving voltage line, and the connection conductive layer includes a same material as that of the other of the data line and the driving voltage line.

This application claims priority to Korean Patent Application No.10-2016-0154453, filed on Nov. 18, 2016, and all the benefits accruingtherefrom under 35 U.S.C. § 119, the content of which in its entirety isherein incorporated by reference.

BACKGROUND

1. Field

Exemplary embodiments relate to a display device.

2. Description of the Related Art

Purposes of a display device have been diversified. Also, since thedisplay device has a thin thickness and is lightweight, the range ofusage of the display device has been gradually widened. As the displaydevice is utilized variously, design purposes of the display device suchas reduction in the area of a non-display area have been diversified.

SUMMARY

Exemplary embodiments are directed to a display device having astructure in which at least a portion of a non-display area is flexible.However, these exemplary embodiments are provided as examples and thescope of the disclosure is not limited thereto.

Additional features will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

According to an exemplary embodiment, a display device includes asubstrate including a display area and a peripheral area, outside thedisplay area, which includes a flexible area in which the substrate isflexible around a bending axis located and extending in one direction, adata line and a driving voltage line disposed in the display area, aninorganic insulating layer on the substrate and which defines an openingcorresponding to the flexible area, a first conductive layer and asecond conductive layer disposed in the peripheral area and which arespaced apart from each other around the opening, an organic insulatinglayer which covers the first conductive layer and the second conductivelayer, and a connection conductive layer on the organic insulatinglayer. The connection conductive layer connects the first conductivelayer and the second conductive layer via contact holes defined in theorganic insulating layer, the first conductive layer and the secondconductive layer includes a same material as that of one of the dataline and the driving voltage line, and the connection conductive layerincludes a same material as that of the other of the data line and thedriving voltage line.

In an exemplary embodiment, the first conductive layer and the secondconductive layer may be disposed on the inorganic insulating layer.

In an exemplary embodiment, a portion of the organic insulating layermay be disposed between the data line and the driving voltage line.

In an exemplary embodiment, the display device may further include athird conductive layer inside the opening and which includes the samematerial as that of the first conductive layer and the second conductivelayer.

In an exemplary embodiment, the connection conductive layer may connectto the third conductive layer via a contact hole defined in the organicinsulating layer.

In an exemplary embodiment, the connection conductive layer may includea first connection conductive layer which connects the first conductivelayer to the third conductive layer and a second connection conductivelayer which connects the second conductive layer to the third conductivelayer and is spaced apart from the first connection conductive layer.

In an exemplary embodiment, the third conductive layer may include aplurality of sub-conductive layers spaced apart from each other insidethe opening, and the connection conductive layer may further include anadditional connection conductive layer which connects adjacentsub-conductive layers among the plurality of sub-conductive layers.

In an exemplary embodiment, the display device may further include anadditional driving voltage line which overlaps at least a portion of thedriving voltage line and is spaced apart from the driving voltage lineand electrically connected to the driving voltage line.

In an exemplary embodiment, the additional driving voltage line mayinclude the same material as that of the data line.

In an exemplary embodiment, the substrate may include a plastic layer,and at least a portion of the organic insulating layer inside theopening directly may contact the plastic layer of the substrate.

In an exemplary embodiment, the substrate may further include aninorganic barrier layer on the plastic layer and which defines anopening corresponding to the opening of the inorganic insulating layerand exposing the plastic layer.

According to an exemplary embodiments, a display device includes asubstrate including a display area and a peripheral area, outside thedisplay area, where includes a flexible area, a thin film transistordisposed in the display area and which includes a semiconductor layerand a gate electrode, an inorganic insulating layer on the substrate andwhich covers the gate electrode and defines an opening corresponding tothe flexible area, a pixel electrode disposed in the display area andwhich is connected to the thin film transistor, a first wiring layer anda second wiring layer disposed in the display area and between theinorganic insulating layer and the pixel electrode, a first conductivelayer and a second conductive layer disposed in the peripheral area,spaced apart from each other around the opening, and on the inorganicinsulating layer, an organic insulating layer which covers the firstconductive layer and the second conductive layer and a connectionconductive layer on the organic insulating layer and which connects thefirst conductive layer and the second conductive layer via contact holesrespectively defined in the organic insulating layer. The firstconductive layer and the second conductive layer includes the samematerial as that of one of the first wiring layer and the second wiringlayer, and the connection conductive layer includes the same material asthat of the other of the first wiring layer and the second wiring layer.

In an exemplary embodiment, a portion of the organic insulating layermay be disposed between the first wiring layer and the second wiringlayer.

In an exemplary embodiment, the first wiring layer and the second wiringlayer may be connected to each other via a contact hole defined in theorganic insulating layer.

In an exemplary embodiment, the first wiring layer and the second wiringlayer may respectively be an upper driving voltage line and a lowerdriving voltage line.

In an exemplary embodiment, the display device may further include adata line and a driving voltage line in the display area and which areelectrically connected to the thin film transistor, one of the firstwiring layer and the second wiring layer may be the data line, and theother of the first wiring layer and the second wiring layer may be thedriving voltage line.

In an exemplary embodiment, the display device may further include athird conductive layer inside the opening and which includes the samematerial as that of the first conductive layer and the second conductivelayer.

In an exemplary embodiment, the connection conductive layer may connectthe third conductive layer via a contact hole defined in the organicinsulating layer.

In an exemplary embodiment, the connection conductive layer may includea plurality of sub-connection conductive layers, and each of theplurality of sub-connection conductive layers may connect two adjacentconductive layers among the first to third conductive layers.

In an exemplary embodiment, the substrate may include a plastic layer,and at least a portion of the organic insulating layer inside theopening may directly contact the plastic layer via the opening.

Exemplary embodiments provide a display device which may implement“bezel-less” by reducing an area of a non-display area and which mayminimize the occurrence of defect such as disconnection. However, thescope of the disclosure is not limited by this effect.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other features will become apparent and more readilyappreciated from the following description of the exemplary embodiments,taken in conjunction with the accompanying drawings in which:

FIG. 1 is a plan view of an exemplary embodiment of a display device;

FIG. 2 is a perspective view of an exemplary embodiment of a portion ofa display device;

FIG. 3 is a circuit diagram of an exemplary embodiment of one pixel ofthe display device of FIG. 1;

FIG. 4 is a plan view of an exemplary embodiment of one pixel of thedisplay device of FIG. 1;

FIG. 5 is a cross-sectional view of an exemplary embodiment of a portionof a display device;

FIG. 6 is a plan view of an exemplary embodiment of a peripheral areaincluding a flexible area of FIG. 5 viewed in a direction K;

FIGS. 7A and 7B respectively are a plan view and a cross-sectional viewof a peripheral area including a flexible area according to a comparedexample;

FIG. 8 is a plan view of another exemplary embodiment of one pixel of adisplay device;

FIG. 9 is a cross-sectional view of another exemplary embodiment of aportion of a display device;

FIGS. 10 to 12 are cross-sectional views of other exemplary embodimentsof a portion of a peripheral area of a display device; and

FIGS. 13 to 15 respectively are plan views of FIGS. 10 to 12.

DETAILED DESCRIPTION

As the disclosure allows for various changes and numerous embodiments,exemplary embodiments will be illustrated in the drawings and describedin detail in the written description. An effect and a characteristic ofthe disclosure, and a method of accomplishing these will be apparentwhen referring to embodiments described with reference to the drawings.This disclosure may, however, be embodied in many different forms andshould not be construed as limited to the exemplary embodiments setforth herein.

As used herein, the term “and/or” includes any and all combinations ofone or more of the associated listed items.

Expressions such as “at least one of” when preceding a list of elements,modify the entire list of elements and do not modify the individualelements of the list.

Hereinafter, the disclosure will be described more fully with referenceto the accompanying drawings, in which exemplary embodiments of thedisclosure are shown. When description is made with reference to thedrawings, like reference numerals in the drawings denote like orcorresponding elements, and repeated description thereof will beomitted.

It will be understood that when an element is referred to as being “on”another element, it can be directly on the other element or interveningelements may be present therebetween. In contrast, when an element isreferred to as being “directly on” another element, there are nointervening elements present.

It will be further understood that the terms “comprises” and/or“comprising,” or “includes” and/or “including” when used in thisspecification, specify the presence of stated features, regions,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,regions, integers, steps, operations, elements, components, and/orgroups thereof.

Furthermore, relative terms, such as “lower” or “bottom” and “upper” or“top,” may be used herein to describe one element's relationship toanother element as illustrated in the Figures. It will be understoodthat relative terms are intended to encompass different orientations ofthe device in addition to the orientation depicted in the Figures. Forexample, if the device in one of the figures is turned over, elementsdescribed as being on the “lower” side of other elements would then beoriented on “upper” sides of the other elements. The exemplary term“lower,” can therefore, encompasses both an orientation of “lower” and“upper,” depending on the particular orientation of the figure.Similarly, if the device in one of the figures is turned over, elementsdescribed as “below” or “beneath” other elements would then be oriented“above” the other elements. The exemplary terms “below” or “beneath”can, therefore, encompass both an orientation of above and below.

It will be understood that although the terms “first”, “second”, etc.may be used herein to describe various components, these componentsshould not be limited by these terms. These components are only used todistinguish one component from another.

As used herein, the singular forms “a” “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise.

It will be further understood that the terms “comprises” and/or“comprising” used herein specify the presence of stated features orcomponents, but do not preclude the presence or addition of one or moreother features or components.

Sizes of elements in the drawings may be exaggerated for convenience ofexplanation. In other words, since sizes and thicknesses of componentsin the drawings are arbitrarily illustrated for convenience ofexplanation, the following exemplary embodiments are not limitedthereto.

When a certain exemplary embodiment may be implemented differently, aspecific process order may be performed differently from the describedorder. For example, two consecutively described processes may beperformed substantially at the same time or performed in an orderopposite to the described order.

It will be understood that when a layer, region, or component isreferred to as being “connected” to another layer, region, or component,it may be “directly connected” to the other layer, region, or componentor may be “indirectly connected” to the other layer, region, orcomponent with other layer, region, or component interposedtherebetween. For example, it will be understood that when a layer,region, or component is referred to as being “electrically connected” toanother layer, region, or component, it may be “directly electricallyconnected” to the other layer, region, or component or may be“indirectly electrically connected” to other layer, region, or componentwith other layer, region, or component interposed therebetween.

Unless otherwise defined, all terms including technical and scientificterms used herein have the same meaning as commonly understood by one ofordinary skill in the art to which this disclosure belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

In the following exemplary embodiments, the x-axis, the y-axis and thez-axis are not limited to three axes of the rectangular coordinatesystem, and may be interpreted in a broader sense. For example, thex-axis, the y-axis, and the z-axis may be perpendicular to one another,or may represent different directions that are not perpendicular to oneanother.

FIG. 1 is a plan view of an exemplary embodiment of a display device 1,and FIG. 2 is a perspective view of an exemplary embodiment of a portionof the display device 1.

Referring to FIG. 1, the display device 1 includes a display unit 10 ona substrate 100. The display unit 10 includes pixels P. Each of thepixels P is connected to a scan line SL extending in a y-direction and adata line DL extending in an x-direction and crossing the y-direction.

In an exemplary embodiment, each pixel P may emit, for example, red,green, blue, or white light and include an organic light-emitting diode(“OLED”). The display unit 10 provides a predetermined image via lightemitted from the pixels P and defines a display area DA. Here, the pixelP denotes a sub-pixel emitting red, green, blue, or white light asdescribed above.

A peripheral area PA is disposed at outside of the display area DA. Inan exemplary embodiment, for example, the peripheral area PA maysurround the display area DA. The peripheral area PA is a region inwhich the pixels P are not arranged and does not provide thepredetermined image via light emitted from the pixels P. In an exemplaryembodiment, the peripheral area PA may include a first scan driver 20and a second scan driver 30, a terminal portion 40, a driving voltagesupply line 60, and a common voltage supply line 70.

In an exemplary embodiment, the first and second scan drivers 20 and 30may be disposed in the peripheral area PA of the substrate 100, generatea scan signal, and transfer the scan signal to the pixel P via the scanline SL. In an exemplary embodiment, for example, the first scan driver20 may be in the left of the display unit 10, and the second scan driver30 may be in the right of the display unit 10. However, the invention isnot limited thereto. In another exemplary embodiment, the display device1 may include only one scan driver in the left or right.

The terminal portion 40 may be disposed in one side of the substrate 100and include a plurality of terminals 41, 42, 43, and 44. The terminalportion 40 may not be covered with an insulating layer, be exposed tooutside, and be electrically connected to a flexible printed circuitboard (“FPCB”).

The FPCB connects a controller 80 to the terminal portion 40electrically. Signals or power transferred from the controller 80 movesto wirings 21, 31, 51, 61, and 71 connected to the terminal portion 40.

The controller 80 receives a vertical synchronization signal, ahorizontal synchronization signal, and a clock signal and generatescontrol signals for controlling driving of the first and second scandrivers 20 and 30. The generated control signals may be transferred tothe first and second scan drivers 20 and 30 respectively via theterminal 43 and the wirings 21 and 31. Scan signals of the first andsecond scan drivers 20 and 30 are provided to the pixels P via the scanlines SL. Also, the controller 80 provides a driving voltage ELVDD and acommon voltage ELVSS to the driving voltage supply line 60 and thecommon voltage supply line 70 respectively via the terminals 42 and 44connected to the FPCB and the wirings 61 and 71. The driving voltageELVDD is provided to each pixel P via a driving voltage line PL, and thecommon voltage ELVSS may be provided to an opposite electrode of thepixel P.

A data driver 50 may be in the FPCB. The data driver 50 provides a datasignal to each pixel P. The data signal of the data driver 50 isprovided to the pixel P via the terminal 41, the wiring 51 connected tothe terminal 41, and the data line DL connected to the wiring 51.Although FIG. 1 illustrates that the data driver 50 is in the FPCB, theinvention is not limited thereto. In another exemplary embodiment, thedata driver 50 may be in the peripheral area PA of the substrate 100.

The driving voltage supply line 60 is in the peripheral area PA. In anexemplary embodiment, for example, the driving voltage supply line 60may be between the terminal portion 50 and the display unit 10. Thedriving voltage ELVDD provided from the controller 80 via the wiring 61connected to the terminal 41 is provided to each pixel P via the drivingvoltage line PL as described above.

The common voltage supply line 70 is in the peripheral area PA andprovides the common voltage ELVSS to an opposite electrode (e.g., acathode) of an OLED of each pixel P. In an exemplary embodiment, forexample, the common voltage supply line 70 has a loop form having oneside open and may extend along edges of the substrate 100 except theterminal portion 40.

The peripheral area PA includes a flexible area BA. The flexible area BAmay be between the terminal portion 40 and the display unit 10. Theflexible area BA may extend in a direction crossing an extendingdirection of the wirings 21, 31, 51, 61, and 71. In an exemplaryembodiment, for example, the flexible area BA may extend in ay-direction with a predetermined width along an x-direction. Theflexible area BA divides the substrate 100 into a first area 1Aincluding the display area DA, and a second area 2A which is an oppositeside to the first area 1A with respect to the flexible area BA. That is,the flexible area BA is between the first area 1A and the second area2A. The first area 1A may include the display area DA and a portion ofthe peripheral area PA. The second area 2A may include only a portion ofthe peripheral area PA.

The display device 1 may be bent or curved around the flexible area BA.As illustrated in FIG. 2, a portion of the substrate 100 of the displaydevice 1 is bent. In an exemplary embodiment, for example, the substrate100 is bent around a bending axis BAX extending in the y-direction andthus the display device 1 has a bent shape like the bent substrate 100.The substrate 100 may include various materials (e.g., a polymer resin)having a flexible or bendable characteristic. For convenience ofdescription, FIG. 2 illustrates a structure in which the substrate 100,not the entire display device 1, is bent.

FIG. 3 is a circuit diagram of an exemplary embodiment of one pixel ofthe display device 1 of FIG. 1.

Referring to FIG. 3, a pixel P may include signal lines SLn, SLn-1, EL,and DL, a plurality of thin film transistors (“TFTs”) T1, T2, T3, T4,T5, T6, and T7 connected to the signal lines, a storage capacitor Cst,an initialization voltage line VL, a driving voltage line PL, and anOLED.

Although FIG. 3 illustrates a case where each pixel P includes thesignal lines SLn, SLn-1, EL, and DL, the initialization voltage line VL,and the driving voltage line PL, the invention is not limited thereto.In another exemplary embodiment, at least one of the signals lines SLn,SLn-1, EL, and DL and/or the initialization voltage line VL may beshared by adjacent pixels.

The TFTs may include a driving TFT T1, a switching TFT T2, acompensation TFT T3, a first initialization TFT T4, an operation controlTFT T5, an emission control TFT T6, and a second initialization TFT T7.

The signal lines include the scan line SLn which transfers a scan signalSn, the previous scan line SLn-1 which transfers a previous scan signalSn-1 to the first initialization TFT T4 and the second initializationTFT T7, the emission control line EL which transfers an emission controlsignal En to the operation control TFT T5 and the emission control TFTT6, and the data line DL which crosses the scan line SLn and transfers adata signal Dm to the switching TFT T2. The driving voltage line PLtransfers the driving voltage ELVDD to the driving TFT T1 via theoperation control TFT T5, and the initialization voltage line VLtransfers an initialization voltage Vint to the driving TFT T1 forinitialization via the first initialization TFT T4 and to a pixelelectrode of the OLED for initialization via the second initializationTFT T7.

A driving gate electrode G1 of the driving TFT T1 is connected to afirst storage capacitor plate Cst1, a driving source electrode S1 of thedriving TFT T1 is electrically connected to the driving voltage line PLvia the operation control TFT T5, and a driving drain electrode D1 ofthe driving TFT T1 is electrically connected to the pixel electrode ofthe OLED via the emission control TFT T6. The driving TFT T1 receivesthe data signal Dm and supplies a driving current I_(OLED) to the OLEDin response to a switching operation of the switching TFT T2.

A switching gate electrode G2 of the switching TFT T2 is connected tothe scan line SLn, a switching source electrode S2 of the switching TFTT2 is connected to the data line DL, and a switching drain electrode D2of the switching TFT T2 is connected to the driving source electrode S1of the driving TFT T1 and electrically connected to the driving voltageline PL via the operation control TFT T5. The switching TFT T2 is turnedon in response to a scan signal Sn transferred via the scan line SLn andperforms the switching operation of transferring the data signal Dm fromthe data line DL to the driving source electrode S1 of the driving TFTT1.

A compensation gate electrode G3 of the compensation TFT T3 is connectedto the scan line SLn, a compensation source electrode S3 of thecompensation TFT T3 is connected to the driving drain electrode D1 ofthe driving TFT T1 and electrically connected to the pixel electrode ofthe OLED via the emission control TFT T6, and a compensation drainelectrode D3 of the compensation TFT T3 is connected to the firststorage capacitor plate Cst1 of the storage capacitor Cst, a firstinitialization drain electrode D4 of the first initialization TFT T4,and the driving gate electrode G1 of the driving TFT T1. Thecompensation TFT T3 is turned on in response to the scan signal Sntransferred via the scan line SLn, and the turned-on TFT T3 makes thedriving TFT T1 function as a diode by electrically connecting thedriving gate electrode G1 of the driving TFT T1 to the driving drainelectrode D1 of the driving TFT T1.

A first initialization gate electrode G4 of the first initialization TFTT4 is connected to the previous scan line SLn-1, a first initializationsource electrode S4 of the first initialization TFT T4 is connected to asecond initialization drain electrode D7 of the second initializationTFT T7 and the initialization voltage line VL, and the firstinitialization drain electrode D4 of the first initialization TFT T4 isconnected to the first storage capacitor plate Cst1 of the storagecapacitor Cst, the compensation drain electrode D3 of the compensationTFT T3, and the driving gate electrode G1 of the driving TFT T1. Thefirst initialization TFT T4 is turned on in response to the previousscan signal Sn-1 transferred via the previous scan line SLn-1 andinitializes a voltage of the driving gate electrode G1 of the drivingTFT T1 by transferring the initialization voltage Vint to the drivinggate electrode G1 of the driving TFT T1.

An operation control gate electrode G5 of the operation control TFT T5is connected to the emission control line EL, an operation controlsource electrode S5 of the operation control TFT T5 is connected to thedriving voltage line PL, and an operation control drain electrode D5 ofthe operation control TFT T5 is connected to the driving sourceelectrode S1 of the driving TFT T1 and connected to the switching drainelectrode D2 of the switching TFT T2.

An emission control gate electrode G6 of the emission control TFT T6 isconnected to the emission control line EL, an emission control sourceelectrode S6 of the emission control TFT T6 is connected to the drivingdrain electrode D1 of the driving TFT T1 and connected to thecompensation source electrode S3 of the compensation TFT T3, and anemission control drain electrode D6 of the emission control TFT T6 isconnected to the second initialization source electrode S7 of the secondinitialization TFT T7 and connected to the pixel electrode of the OLED.

The operation control TFT T5 and the emission control TFT T6 aresimultaneously turned on in response to the emission control signal Entransferred via the emission control line EL, transfer the drivingvoltage ELVDD to the OLED, and allow the driving current I_(OLED) toflow through the OLED.

A second initialization gate electrode G7 of the second initializationTFT T7 is connected to the previous scan line SLn-1, a secondinitialization source electrode S7 of the second initialization TFT T7is connected to the emission control drain electrode D6 of the emissioncontrol TFT T6 and connected to the pixel electrode of the OLED, and asecond initialization drain electrode D7 of the second initializationTFT T7 is connected to the first initialization source electrode S4 ofthe first initialization TFT T4 and connected to the initializationvoltage line VL. The second initialization TFT T7 is turned on inresponse to a previous scan signal Sn-1 transferred via the previousscan line SLn-1 and initializes the pixel electrode of the OLED usingthe initialization voltage Vint.

Although FIG. 3 illustrates a case where the first initialization TFT T4and the second initialization TFT T7 are connected to the previous scanline SLn-1, the invention is not limited thereto. In another exemplaryembodiment, the first initialization TFT T4 may be connected to theprevious scan line SLn-1 and driven in response to the previous scansignal Sn-1, and the second initialization TFT T7 may be connected to aseparate signal line (e.g., a next scan line) and driven in response toa signal transferred via the separate signal line.

A second storage capacitor plate Cst2 of the storage capacitor Cst isconnected to the driving voltage line PL, and an opposite electrode ofthe OLED is connected to the common voltage ELVSS. Therefore, the OLEDmay display an image by receiving the driving current I_(OLED) from thedriving TFT T1 and emitting light.

Although FIG. 3 illustrates that the compensation TFT T3 and the firstinitialization TFT T4 have dual gate electrodes, the invention is notlimited thereto. For example, in another exemplary embodiment, thecompensation TFT T3 and the first initialization TFT T4 may have onegate electrode. Also, in still another exemplary embodiment, at leastone of the other TFTs T1, T2, T5, T6, and T7 besides the compensationTFT T3 and the first initialization TFT T4 may have dual gateelectrodes, and various modifications may be made.

FIG. 4 is a plan view of an exemplary embodiment of one pixel of thedisplay device of FIG. 1, FIG. 5 is a cross-sectional view of anexemplary embodiment of a portion of a display device, FIG. 6 is a planview of an exemplary embodiment of a peripheral area PA including aflexible area BA of FIG. 5 viewed in a direction K, and FIGS. 7A and 7Brespectively are a plan view and a cross-sectional view of a peripheralarea including a flexible area according to a compared example.Specifically, FIG. 7B is a cross-sectional view of taken along lineVIIb-VIIb′ of FIG. 7A. For convenience of description, FIG. 5illustrates a state in which the display device is not bent, and across-sectional view of a display area DA of FIG. 5 corresponds to across-sectional view of an exemplary embodiment of one pixel taken alonglines A-A′ and B-B′ of FIG. 4.

FIG. 4 is an arrangement view of an exemplary embodiment of locations ofthe plurality of TFTs and the capacitor of the one pixel of FIG. 3. Thearrangement illustrated in FIG. 4 is an arrangement view of one pixel.Pixels which are the same as or similar to the pixel of FIG. 4 may bearranged to the top, the bottom, the left, and the right of the pixel ofFIG. 4.

First, a display area DA of FIGS. 4 and 5 is mainly described and thenflexible areas BA of FIGS. 5 to 7B are described.

Referring to FIG. 4, a scan line 121, a previous scan line 122, and anemission control line 123 extend in the y-direction, and a data line 171and driving voltage lines 172 and 178 extend in the x-direction crossingthe y-direction.

The driving TFT T1, the switching TFT T2, the compensation TFT T3, thefirst initialization TFT T4, the operation control TFT T5, the emissioncontrol TFT T6, and the second initialization TFT T7 may be disposed ona buffer layer BL (refer FIG. 5).

A driving semiconductor layer 130 a corresponding to the driving TFT T1,a switching semiconductor layer 130 b corresponding to the switching TFTT2, a compensation semiconductor layer 130 c corresponding to thecompensation TFT T3, an initialization semiconductor layer 130 dcorresponding to the first initialization TFT T4, an operation controlsemiconductor layer 130 e corresponding to the operation control TFT T5,an emission control semiconductor layer 130 f corresponding to theemission control TFT T6, and a second initialization channel region 130g corresponding to the second initialization TFT T7 may be disposed onthe buffer layer BL. These semiconductor layers may be connected to eachother, and may be curved in various forms.

In an exemplary embodiment, the semiconductor layers may includepolycrystalline silicon, for example. Each of the semiconductor layersmay include a channel region not doped with impurities, a source regionand a drain region. The source region and the drain region arerespectively disposed at opposite sides of the channel region and dopedwith impurities. The channel region of the semiconductor layer overlapsthe scan line 121, the previous scan line 122, or the emission controlline 123. The semiconductor layer may be doped with the impurities byusing the scan line 121, the previous scan line 122, or the emissioncontrol line 123 as a self-align mask. Here, types of the impurities maychange depending on a type of a TFT and include N-type impurities orP-type impurities. The channel region, the source region at one side ofthe channel region, and the drain region at the other side of thechannel region may also be referred to as an active layer. That is, aTFT has an active layer and the active layer includes the channelregion, the source region, and the drain region.

The doped source region and drain region respectively correspond to asource electrode and a drain electrode of a TFT. In an exemplaryembodiment, as illustrated in the display area DA of FIGS. 4 and 5, thedriving source electrode may correspond to a driving source region 176 adoped with impurities, and the driving drain electrode may correspond toa driving drain region 177 a doped with impurities. Hereinafter, forconvenience of description, terms of a source region or a drain regionare used instead of a source electrode or a drain electrode.

The driving TFT T1 includes a driving gate electrode 125 a and thedriving semiconductor layer 130 a including a driving channel region,the driving source region 176 a and the driving drain region 177 a. Thedriving channel region of the semiconductor layer 130 a overlaps thedriving gate electrode 125 a. The driving channel region of thesemiconductor layer 130 a has a curved form and thus may have a longchannel length. Although FIG. 4 illustrates the driving channel regionhaving a curved shape in a form of an “omega,” the invention is notlimited thereto. The driving gate electrode 125 a may serve as the gateelectrode of the driving TFT T1 and simultaneously serve as the firststorage capacitor plate of the storage capacitor Cst described below. Afirst gate insulating layer GI1 (refer to FIG. 5) is between the drivingsemiconductor layer 130 a and the driving gate electrode 125 a. In anexemplary embodiment, the first gate insulating layer GI1 may be aninorganic layer including SiON, SiOx, and/or SiNx, for example. Thedriving source region 176 a is connected to a switching drain region 177b and an operation control drain region 177 e described below, and thedriving drain region 177 a is connected to a compensation source region176 c and an emission control source region 176 f described below.

The switching TFT T2 includes a switching gate electrode 125 b and theswitching semiconductor layer 130 b including sa witching channelregion, a switching source region 176 b and a switching drain region 177b. The switching channel region of the switching semiconductor layer 130b overlaps the switching gate electrode 125 b, and the switching gateelectrode 125 b corresponds to a portion of the scan line 121 whichoverlaps the switching channel region of the switching semiconductorlayer 130 b. The switching source region 176 b is electrically connectedto the data line 171 via a contact hole 164 defined in the first gateinsulating layer GI1, a second gate insulating layer GI2, and aninterlayer insulating layer ILD. In an exemplary embodiment, the secondgate insulating layer GI2 and the interlayer insulating layer ILD may beinorganic layers including SiON, SiOx, and/or SiNx, for example. Theswitching drain region 177 b is connected to the driving TFT T1 and theoperation control TFT T5.

The compensation TFT T3 includes compensation gate electrodes 125 c 1and 125 c 2 and the compensation semiconductor layer 130 c including acompensation channel region, a compensation source region 176 c and acompensation drain region 177 c. The compensation channel region of thecompensation semiconductor 130 c overlaps the compensation gateelectrodes 125 c 1 and 125 c 2. The compensation gate electrodes 125 c 1and 125 c 2 correspond to a portion of the scan line 121 which overlapsthe compensation channel region of the compensation semiconductor 130 c.The compensation gate electrodes 125 c 1 and 125 c 2 are dual gateelectrodes including the first gate electrode 125 c 1 and the secondgate electrode 125 c 2 and may prevent or reduce the occurrence of aleakage current. The compensation drain region 177 c may be connected tothe first storage capacitor plate 125 a of the storage capacitor Cst viaa connection member 174. The first storage capacitor plate 125 a of thestorage capacitor Cst may also serve as the gate electrode of thedriving TFT T1 described above.

The connection member 174 may include the same material as that of thedata line 171 and may be in the same layer as a layer in which the dataline 171 is disposed. One end of the connection member 174 may beelectrically connected to the compensation drain region 177 c and theinitialization drain region 177 d via a contact hole 166 defined in thefirst and second gate insulating layers GI1 and GI2 and the interlayerinsulating layer ILD. The other end of the connection member 174 may beelectrically connected to the first storage capacitor plate 125 a via acontact hole 167 defined in the second gate insulating layer GI2 and theinterlayer insulating layer ILD. The other end of the connection member174 may also be connected to the first storage capacitor plate 125 a viaa storage capacitor opening 127 a in a second storage capacitor plate127.

The first initialization TFT T4 includes first initialization gateelectrodes 125 d 1 and 125 d 2 and the first initializationsemiconductor layer 130 d including a first initialization channelregion, a first initialization source region 176 d and a firstinitialization drain region 177 d. The first initialization channelregion of the first initialization semiconductor layer 130 d overlapsthe first initialization gate electrodes 125 d 1 and 125 d 2. The firstinitialization gate electrodes 125 d 1 and 125 d 2 correspond toportions of the previous scan line 122 which overlap the firstinitialization channel region of the first initialization semiconductorlayer 130 d. The first initialization gate electrodes 125 d 1 and 125 d2 are dual gate electrodes including the first gate electrode 125 d 1and the second gate electrode 125 d 2 and may prevent or reduce theoccurrence of a leakage current. The first initialization source region176 d is connected to an initialization voltage line 124 via aninitialization connection line 173. The initialization voltage line 124includes the same material as that of the second storage capacitor plate127 and may be in the same layer in which the second storage capacitorplate 127 is disposed. One end of the initialization connection line 173may be electrically connected to the initialization voltage line 124 viaa contact hole 161 defined in the second gate insulating layer GI2 andthe interlayer insulating layer ILD. The other end of the initializationvoltage line 124 may be electrically connected to the initializationsource region 176 d via a contact hole 162 defined in the first gateinsulating layer GI1, the second gate insulating layer GI2, and theinterlayer insulating layer ILD.

The operation control TFT T5 includes an operation control gateelectrode 125 e and the operation control semiconductor layer 130 eincluding an operation control channel region, an operation controlsource region 176 e and an operation control drain region 177 e. Theoperation control channel region of the operation control semiconductorlayer 130 e overlaps the operation control gate electrode 125 e. Theoperation control gate electrode 125 e corresponds to a portion of theemission control line 123 which overlaps the operation control channelregion of the operation control semiconductor layer 130 e. The operationcontrol source region 176 e may be electrically connected to a lowerdriving voltage line 172 via a contact hole 165 defined in the first andsecond gate insulating layer GI1 and GI2 and the interlayer insulatinglayer ILD. In this case, a portion neighboring the contact hole 165 ofthe lower driving voltage line 172 may correspond to the source region176 e, that is, the source electrode of the operation control TFT T5.

The emission control TFT T6 includes an emission control gate electrode125 f and the emission control semiconductor layer 130 f including anemission control channel region, an emission control source region 176 fand an emission control drain region 177 f. The emission control channelregion of the emission control semiconductor layer 130 f overlaps theemission control gate electrode 125 f. The emission control gateelectrode 125 f corresponds to a portion of the emission control line123 which overlaps the emission control channel region of the emissioncontrol semiconductor layer 130 f. The emission control drain region 177f may be electrically connected to an intermediate connection layer 175on the interlayer insulating layer ILD via a contact hole 163 defined inthe first and second gate insulating layers GI1 and GI2 and theinterlayer insulating layer ILD. The intermediate connection layer 175,the data line 171 and the lower driving voltage line 172 may be disposedon the interlayer insulating layer ILD. The intermediate layer 175 iselectrically connected to an auxiliary connection layer 179 via acontact hole 183. The auxiliary connection layer 179 is electricallyconnected to a pixel electrode 310 of an OLED via a contact hole 185.

The second initialization TFT T7 includes a second initialization gateelectrode 125 g and the second initialization semiconductor layer 130 gincluding a second initialization channel region, a secondinitialization source region 176 g and a second initialization drainregion 177 g. The second initialization channel region of the secondinitialization semiconductor layer 130 g overlaps the secondinitialization gate electrode 125 g. The second initialization gateelectrode 125 g corresponds to a portion of the previous scan line 122which overlaps the second initialization channel region of the secondinitialization semiconductor layer 130 g. The second initializationsource region 176 g is connected to the emission control drain electrodeD6 of the emission control TFT T6 and the pixel electrode 310 of theOLED. The second initialization drain region 177 g is connected to thefirst initialization source electrode S4 of the first initialization TFTT4 and the initialization voltage line 124. The second initializationTFT T7 is turned on in response to a previous scan signal transferredvia the previous scan line 122 and initializes the pixel electrode 310of the OLED.

The storage capacitor Cst includes the first storage capacitor plate 125a and the second storage capacitor plate 127. The second storagecapacitor plate 127 overlaps the first storage capacitor plate 125 awith the second gate insulating layer GI2 therebetween.

In an exemplary embodiment, the scan line 121, the previous scan line122, the emission control line 123, and the driving gate electrodes 125a which also serves as the first storage capacitor plate may be directlyon the same layer such as the first gate insulating layer Gil asillustrated in the display area DA of FIG. 5. In an exemplaryembodiment, the scan line 121, the previous scan line 122, the emissioncontrol line 123, and the driving gate electrodes 125 a which alsoserves as the first storage capacitor plate may include at least one ofMo, Al, Cu, Ti, etc. and include a single layer or a multi-layer. Forexample, the scan line 121, the previous scan line 122, the emissioncontrol line 123, and the driving gate electrodes 125 a which alsoserves as the first storage capacitor plate may be a single layerincluding Mo.

In an exemplary embodiment, the second storage capacitor plate 127 andthe initialization voltage line 124 may be directly on the same layersuch as the second gate insulating layer GI2 as illustrated in thedisplay area DA of FIG. 5. In an exemplary embodiment, the secondstorage capacitor plate 127 and the initialization voltage line 124 mayinclude at least one of Mo, Al, Cu, Ti, etc. and include a single layeror a multi-layer. For example, the second storage capacitor plate 127and the initialization voltage line 124 may be a single layer includingMo or a multi-layer including Mo/Al/Mo.

In an exemplary embodiment, the data line 171, the lower driving voltageline 172, the initialization connection line 173, the connection line174, and the intermediate connection layer 175 may be directly on thesame layer such as the interlayer insulating layer ILD as illustrated inthe display area DA of FIG. 5. The data line 171, the lower drivingvoltage line 172, the initialization connection line 173, the connectionline 174, and the intermediate connection layer 175 may include the samematerial. In an exemplary embodiment, the data line 171, the lowerdriving voltage line 172, the initialization connection line 173, theconnection line 174, and the intermediate connection layer 175 mayinclude, for example, at least one of Mo, Al, Cu, and Ti and include asingle layer or a multi-layer. In an exemplary embodiment, the data line171, the lower driving voltage line 172, the initialization connectionline 173, the connection line 174, and the intermediate connection layer175 may have a multi-layered structure including Ti/Al/Ti.

The lower driving voltage line 172 is electrically connected to theupper driving voltage line 178. In an exemplary embodiment, for example,the lower driving voltage line 172 is electrically connected to theupper driving voltage line 178 via a contact hole 181 defined in a firstorganic insulating layer PL1 between the lower driving voltage line 172and the upper driving voltage line 178. The driving voltage lines 172and 178 supply a constant electric signal, that is, the driving voltageELVDD to a plurality of pixels. To implement a display device providinga high quality image, it is desirable that a voltage drop of the drivingvoltage lines 172 and 178 should not occur. Since the driving voltageline of the exemplary embodiment has the lower and upper driving voltagelines electrically connected each other, for example, the upper drivingvoltage line 178 is electrically connected to the lower driving voltageline 172 according to an exemplary embodiment, the resistance of thedriving voltage line of the exemplary embodiment may be reduced orminimized. Therefore, the voltage drop due to resistance of the drivingvoltage lines 172 and 178 may be effectively reduced even if an area ofa pixel P is reduced in order to implement a high resolution displaydevice.

In an exemplary embodiment, the upper driving voltage line 178 mayinclude at least one of Mo, Al, Cu, Ti, for example, and include asingle layer or a multi-layer. In an exemplary embodiment, the upperdriving voltage line 178 may have a multi-layered structure includingTi/Al/Ti, for example.

As illustrated in FIG. 5, a passivation layer PVX may be on the dataline 171, the lower driving voltage line 172, the initializationconnection line 173, the connection member 174, and the intermediateconnection layer 175. In an exemplary embodiment, the passivation layerPVX may include, for example, SiNx. Since hydrogen of SiNx combines witha dangling bond of a semiconductor layer, and removes a defect site ofthe semiconductor layer, electrical characteristics of TFTs can beimproved.

Though not shown, the passivation layer PVX may cover a portion ofwirings exposed from the peripheral area PA and protect the wirings. Forexample, at least a portion of the wirings 21, 31, 51, 61, and 71without the passivation layer PVX may be exposed from a portion of theperipheral area PA, and the exposed portion may be damaged by etchantused while the pixel electrode 310 (see FIG. 5) is patterned. However,according to an exemplary embodiment, the passivation layer PVX mayprotect the wirings 21, 31, 51, 61, and 71 by covering the portion ofthe wirings 21, 31, 51, 61, and 71.

The upper driving voltage line 178 and the auxiliary connection line 179may be covered with a second organic insulating layer PL2. The first andsecond organic insulating layers PL1 and PL2 may include an organicmaterial. In an exemplary embodiment, the organic material may include ageneral-purpose polymer such as an imide-based polymer,polymethylmethacrylate (“PMMA”) or polystyrene (“PS”), or polymerderivatives having a phenol-based group, an acryl-based polymer, an arylether-based polymer, an amide-based polymer, a fluorine-based polymer, ap-xylene-based polymer, a vinyl alcohol-based polymer, or a blendthereof.

The OLED may be on the second organic insulating layer PL2. The OLED mayinclude the pixel electrode 310, an opposite electrode 330, and anintermediate layer 320 therebetween. The intermediate layer 320 mayinclude an emission layer.

A pixel-defining layer 150 may be disposed on the pixel electrode 310.The pixel-defining layer 150 defines a pixel by including an openingcorresponding to each sub-pixel, that is, an opening exposing at least acentral portion of the pixel electrode 310. Also, the pixel-defininglayer 150 may prevent an arc, etc. from occurring between the pixelelectrode 310 and the opposite electrode 330 by increasing a distancebetween an edge of the pixel electrode 310 and the opposite electrode330. In an exemplary embodiment, the pixel-defining layer 150 mayinclude an organic material such as polyimide (“PI”) orhexamethyldisiloxane (“HMDSO”).

In an exemplary embodiment, the intermediate layer 320 may include a lowmolecular or polymer material. In the case where the intermediate layer320 includes a low molecular material, the intermediate layer 320 mayhave a structure in which a hole injection layer (“HIL”), a holetransport layer (“HTL”), an emission layer (“EML”), an electrontransport layer (“ETL”), an electron injection layer (“EIL”), etc. arestacked in a single or a composite configuration, and may includevarious organic materials such as copper phthalocyanine (“CuPc”),N,N′-Di(naphthalene-1-yl)-N,N′-diphenyl-benzidine (“NPB”), andtris-8-hydroxyquinoline aluminum (“Alq3”). These layers may be providedby vacuum evaporation.

In the case where the intermediate layer 320 includes a polymermaterial, the intermediate layer 320 may have a structure including anHTL and an EML, for example. In this case, the HTL may include a PEDOT,and the EML may include a polymer material such as polyphenylenevinylene (“PPV”)-based material and a polyfluorene-based material. Thestructure of the intermediate layer 320 is not limited to theabove-described structure but may have various structures. In anexemplary embodiment, for example, the intermediate layer 320 may be onelayer which covers a plurality of pixel electrodes 310 or may includelayers, each of which is patterned to correspond to each of theplurality of pixel electrodes 310.

The opposite electrode 330 may be disposed in upper part of the displayarea DA and cover the display area DA. That is, the opposite electrode330 may have one body which covers a plurality of OLEDs and correspondto the plurality of pixel electrodes 310.

Since the OLED may be easily damaged by external moisture or oxygen, theOLED may be protected by being covered with an encapsulation layer 400.The encapsulation layer 400 may cover the display area DA and extend toan outside of the display area DA. The encapsulation layer 400 mayinclude a first inorganic encapsulation layer 410, an organicencapsulation layer 420, and a second inorganic encapsulation layer 430.

In an exemplary embodiment, the first inorganic encapsulation layer 410may cover the opposite electrode 330 and include SiOx, SiNx, and/orSiON, for example. Though not shown, other layers such as a cappinglayer may be disposed between the first inorganic encapsulation layer410 and the opposite electrode 330. Since the first inorganicencapsulation layer 410 may be disposed along an uneven structurethereunder and have the same thickness along the display area DA, anupper surface of the first inorganic encapsulation layer 410 may not beplanar. The organic encapsulation layer 420 covers the first inorganicencapsulation layer 410. Unlike the first inorganic encapsulation layer410, the organic encapsulation layer 420 may have a variable thicknessalong the display area DA such that an upper surface of the organicencapsulation layer 420 corresponding to the display area DA may beapproximately planar. In an exemplary embodiment, the organicencapsulation layer 420 may include at least one of polyethyleneterephthalate (“PET”), polyethylene naphthalate (“PEN”), polycarbonate(“PC”), PI, polyethylene sulfonate, polyoxymethylene (“POM”),polyarylate, and HMDSO, for example. In an exemplary embodiment, thesecond inorganic encapsulation layer 430 may cover the organicencapsulation layer 420 and include SiOx, SiNx, and/or SiON, forexample.

By virtue of the above-described multi-layered structure of theencapsulation layer 400, even when a crack occurs inside theencapsulation layer 400, the encapsulation layer 400 may prevent thecrack from being transferred between the first inorganic encapsulationlayer 410 and the organic encapsulation layer 420, or between theorganic encapsulation layer 420 and the second inorganic encapsulationlayer 430. Therefore, the encapsulation layer 400 may prevent orminimize forming of a path through which external moisture or oxygenpenetrates into the display area DA. Though not shown, a polarizationplate may be disposed on the encapsulation layer 400 by using a lighttransmission adhesive. The polarization plate is a structure forreducing external light reflection. Instead of the polarization plate, alayer including a black matrix and a color filter may be used.

Referring to the peripheral area PA around the flexible area BA of FIG.5, the buffer layer BL, the first and second gate insulating layers GI1and GI2, and the interlayer insulating layer ILD on the substrate 100may be collectively referred to as inorganic insulating layers IL. In anexemplary embodiment, the inorganic layers IL may include an inorganicmaterial such as SiOx, SiNx, and/or SiON. FIG. 5 illustrates that aninorganic insulating layer IL in the peripheral area PA around theflexible area BA includes the buffer layer BL, the first and second gateinsulating layers GI1 and GI2, and the interlayer insulating layer ILD.In another exemplary embodiment, the inorganic insulating layer IL mayinclude at least one of the buffer layer BL, the first and second gateinsulating layers GI1 and GI2, and the interlayer insulating layer ILD,for example.

The inorganic insulating layer IL includes an opening OP correspondingto the flexible area BA. The buffer layer BL, the first and second gateinsulating layers GI1 and GI2, and the interlayer insulating layer ILDmay respectively define openings op1, op2, op3, and op4 corresponding tothe flexible area BA.

If the inorganic insulating layer IL is continuously provided from thefirst area 1A to the second area 2A without the opening OP in theflexible area BA, while the display device 1 is bent, stress may beapplied to the inorganic insulating layer IL. Since, unlike an organiclayer, an inorganic layer has a high hardness, a crack may easily occurin the inorganic insulating layer IL due to the bending of the displaydevice 1. In the case where a crack occurs in the inorganic insulatinglayer IL, a crack, etc. may also occur in first and second conductivelayers 213 a and 213 b disposed on the inorganic insulating layer IL andcause a defect such as disconnection.

However, according to an exemplary embodiment of the invention, sincethe inorganic insulating layer IL includes the opening OP, the inorganicinsulating layer IL may prevent or reduce the occurrence of a crack,etc. by stress efficiently. In this case, the opening OP has a width OWin the x-direction which is greater than the width of the flexible areaBA and thus minimizes a defect by a crack.

The substrate 100 may have a flexible or bendable characteristic byincluding at least one plastic layer. The substrate 100 may include afirst plastic layer 101 and a second plastic layer 105. The substrate100 may include a first barrier layer 103 and a second barrier layer107. The first barrier layer 103 may be disposed between the firstplastic layer 101 and the second plastic layer 105, and the secondbarrier layer 107 may be disposed between the second plastic layer 105and the buffer layer BL.

In an exemplary embodiment, the first and second plastic layers 101 and105 may include at least one of PI, polyether sulphone (“PES”),polyacrylate, polyether imide (“PEI”), PEN, PET, polyphenylene sulfide(“PPS”), polyarylate, PC, tri-cellulose acetate (“TAC”), celluloseacetate propionate (“CAP”), cyclic olefin polymer, and cyclic olefincopolymer, for example.

In an exemplary embodiment, the first and second barrier layers 103 and107 may include an inorganic material such as SiOx, SiNx, and/or SiONand prevent external impurities from penetrating into the first andsecond plastic layers 101 and 105 and damaging or deteriorating a TFT.

The second barrier layer 107 may define an opening 107 a correspondingto the flexible area BA. The second plastic layer 105 of the substrate100 may be exposed via the opening 107 a of the second barrier layer107. Like the above description, to prevent the occurrence of a crack bythe stress to the second barrier layer 107 while the display device 1 isbent, the second barrier layer 107 may have the opening 107 acorresponding to the opening OP of the inorganic insulating layer IL. Inthe present specification, “correspond” may be understood as “overlap.”

Although FIG. 5 illustrates that inner lateral surfaces of the openingop1 defined by the buffer layer BL, the opening op2 defined by the firstgate insulating layer GI1, the opening op3 defined by the second gateinsulating layer GI2, the opening op4 defined by the interlayerinsulating layer ILD, and the opening 107 a defined by the secondbarrier layer 107 coincide with each other, the invention is not limitedthereto. In another exemplary embodiment, the inner lateral surfaces ofthe openings op1, op2, op3, op4, and 107 a may not coincide with eachother, and the openings op1, op2, op3, op4, and 107 a may respectivelyhave different sizes. In this case, the opening OP of the inorganicinsulating layer IL may be defined as one of the openings having asmallest size from among the openings op1, op2, op3, op4, and 107 a.

The first conductive layer 213 a and the second conductive layer 213 bare spaced apart from each other on the inorganic insulating layer IL,for example, the interlayer insulating layer ILD. The first conductivelayer 213 a is separated from the second conductive layer 213 b with theopening OP defined by the inorganic insulating layer IL therebetween.The first conductive layer 213 a and the second conductive layer 213 bseparated from each other are electrically connected by a connectionconductive layer 215 on the first organic insulating layer PL1. Astructure of the first conductive layer 213 a and the second conductivelayer 213 b separated from each other in the flexible area BA and astructure of the connection conductive layer 215 connecting the firstconductive layer 213 a to the second conductive layer 213 b maycorrespond to a structure of at least one of the wirings 21, 31, 51, 61,and 71.

The first conductive layer 213 a and the second conductive layer 213 bare disposed on the same layer which may be a similar layer with thelayers on which the data line 171 and the lower driving voltage line 172are disposed and include the same material as that of one of the dataline 171 and the lower driving voltage line 172. The connectionconductive layer 215 is disposed on the same layer as a layer on whichthe upper driving voltage line 178 and the auxiliary connection layer179 are disposed and includes the same material as that of one of theupper driving voltage line 178 and the data line 171. The passivationlayer PVX may be disposed between the first or second conductive layers213 a or 213 b and the connection conductive layer 215, specifically,between the first or second conductive layers 213 a or 213 b and thefirst organic insulating layer PL1. The passivation layer PVX defines anopening PVX-op corresponding to the opening OP defined by the inorganicinsulating layer IL and defines holes PVX-h for contact between thefirst and second conductive layers 213 a and 213 b and the connectionconductive layer 215. The connection conductive layer 215 contacts thefirst and second conductive layers 213 a and 213 b via a contact holeCNT. The passivation layer PVX may protect a portion of a wiring, forexample, a portion of the first and second conductive layers 213 a and213 b not covered with the first and second organic insulating layersPL1 and PL2 in other regions not shown in FIG. 5 in the peripheral areaPA.

The first and second conductive layers 213 a and 213 b may be providedby forming a conductive material layer (not shown) on the inorganicinsulating layer IL defining the opening OP and then etching the same.In an exemplary embodiment, the inorganic insulating layer IL may have athickness from about 20,000 angstroms (Å) to about 24,000 Å, forexample. In this case, a portion of the conductive material layer (notshown) in the opening OP of the inorganic insulating layer IL may remaindue to a step difference of the inorganic insulating layer IL and thus aremnant pattern 213 s may remain on the second barrier layer 107. Asillustrated in FIG. 6 and the peripheral area PA of FIG. 5, the remnantpattern 213 s is near to an edge of the opening OP, that is, an innerlateral surface of the inorganic insulating layer IL. Hereinafter, forconvenience of description, a state in which the remnant pattern 213 sexists is mainly described.

If a first conductive layer is not spaced apart from a second conductivelayer in the opening of the inorganic insulating layer therebetween,that is, if a conductive layer 2213 extends without disconnection in theopening OP of the inorganic insulating layer IL as illustrated in FIGS.7A and 7B, a short-circuit may occur between adjacent conductive layers2213 due to a remnant pattern 2213 s remaining between the adjacentconductive layers 2213. Here, each conductive layer 2213 may be at leastone of the wirings 21, 31, 51, 61, and 71 described above with referenceto FIG. 1. In this case, a normal operation of the display device 1 isimpossible.

However, according to an exemplary embodiment of the invention asdescribed above, the first conductive layer 213 a and the secondconductive layer 213 b are spaced apart from each other, therebyavoiding a short-circuit with the remnant pattern 213 s and electricallyconnected via the connection conductive layer 215. Therefore, in anexemplary embodiment, a wiring, for example, the wirings 21, 31, 51, 61,and 71 described above with reference to FIG. 1 may easily perform theirfunctions without an unnecessary electric short-circuit. Although FIG. 5illustrates a state in which a third conductive layer 213 c is patternedin the opening OP, the third conductive layer 213 c may be omitted. Thethird conductive layer 213 c may have the same material as that of thefirst conductive layer 213 a and the second conductive layer 213 b.

Referring to FIG. 5, a portion of the first organic insulating layer PL1disposed between the first and second conductive layers 213 a and 213 band the connection conductive layer 215 fills at least a portion of theopening OP of the inorganic insulating layer IL. The portion of thefirst organic insulating layer PL1 is disposed inside the opening OP ofthe inorganic insulating layer IL. At least a portion of the firstorganic insulating layer PL1 inside the opening OP of the inorganicinsulating layer IL may directly contact the second plastic layer 105via the opening OP and the opening 107 a of the second barrier layer107. Also, the connection conductive layer 215 may be covered with thesecond organic insulating layer PL2 and the pixel-defining layer 150.Although FIG. 5 illustrates a structure in which the pixel-defininglayer 150 extends to only the display area DA, the pixel-defining layer150 may extend to the flexible area BA in another exemplary embodiment.

A probability that a crack occurs in the first and second organicinsulating layers PL1 and PL2 is low in view of a characteristic of thefirst and second organic insulating layers PL1 and PL2 including anorganic material. Therefore, the first and second organic insulatinglayers PL1 and PL2 may effectively prevent or minimize the occurrence ofa crack in a portion of the connection conductive layer 215corresponding to the flexible area BA. Also, since the first and secondorganic insulating layers PL1 and PL2, which are organic layers, have alower hardness than that of an inorganic layer, the first and secondorganic insulating layers PL1 and PL2 may absorb tensile stressoccurring due to the bending of the display device 1 and thuseffectively minimize concentration of the tensile stress on the firstand second conductive layers 213 a and 213 b and/or the connectionconductive layer 215.

FIG. 8 is a plan view of another exemplary embodiment of one pixel in adisplay area of a display device, and FIG. 9 is a cross-sectional viewof another exemplary embodiment of a portion of a display device. Forconvenience of description, FIG. 9 illustrates a state in which thedisplay device is not bent, and the cross-sectional view of the displayarea DA of FIG. 9 corresponds to a cross-sectional view of anotherexemplary embodiment of one pixel of the display device taken alonglines C-C′ and D-D′ of FIG. 8.

Although FIGS. 4 and 5 illustrate a case where the driving voltage lineof the display device 1 includes double layers including the upperdriving voltage line 178 and the lower driving voltage line 172, theinvention is not limited thereto.

As illustrated in FIGS. 8 and 9, the driving voltage line may be asingle layer including the upper driving voltage line 178. The upperdriving voltage line 178 of FIG. 9 may resolve a problem of a voltagedrop, etc. by having a greater area than that of the upper drivingvoltage line 178 of FIGS. 4 and 5. Since the driving voltage line ofFIGS. 8 and 9 is the same as the driving voltage line described abovewith reference to FIGS. 4 and 5 except that the driving voltage line ofFIGS. 8 and 9 includes a single layer of the upper driving voltage line178, repeated descriptions of other constructions are omitted.

FIGS. 10 to 12 are cross-sectional views of other exemplary embodimentsof a portion of a peripheral area of a display device, and FIGS. 13 to15 respectively are plan views of FIGS. 10 to 12. Since exemplaryembodiments of a display device illustrated in FIGS. 10 to 12 have thesame structure as the exemplary embodiment described above withreference to FIGS. 5 and 9 with only differences in the structure aroundthe flexible area BA of the display device, only the peripheral area PAaround the flexible area BA is illustrated in FIGS. 10 to 12 forconvenience of description.

Referring to FIGS. 10 and 13, the connection conductive layer 215electrically connecting the first and second conductive layers 213 a and213 b may also electrically connect the third conductive layer 213 c inthe opening OP to the first and second conductive layers 213 a and 213b.

Referring to FIGS. 11 and 14, the connection conductive layer 215 mayinclude first and second connection conductive layers 215 a and 215 bwhich are spaced apart from each other. The first connection conductivelayer 215 a may electrically connect the first conductive layer 213 a tothe third conductive layer 213 c. The second connection conductive layer215 b may electrically connect the third conductive layer 213 c to thesecond conductive layer 213 b.

Referring to FIGS. 12 and 15, third conductive layers 213 c 1 and 213 c2 which are spaced apart from each other may be disposed in the openingOP. In this case, the connection conductive layer 215 may include firstto third connection conductive layers 215 a, 215 b, and 215 c which arespaced apart from each other. The first connection conductive layer 215a may electrically connect the first conductive layer 213 a to the thirdconductive layer 213 c 1 disposed near to the first conductive layer 213a. The second connection conductive layer 215 b may electrically connectthe second conductive layer 213 b to the third conductive layer 213 c 2disposed near to the second conductive layer 213 b. The third connectionconductive layer 215 c may electrically connect the conductive layers213 c 1 and 213 c 2.

As illustrated in FIGS. 11, 14, 12, and 15, in the case where theconnection conductive layer 215 includes a plurality of connectionconductive layers spaced apart from each other, a probability that acrack, etc. occur due to tensile stress applied to the connectionconductive layer 215 while the display device is bent may be reducedmore than in the case where the connection conductive layer is onemonolithic layer.

Although the disclosure has been described with reference to theexemplary embodiments illustrated in the drawings, this is merelyprovided as an example and it will be understood by those of ordinaryskill in the art that various changes in form and details andequivalents thereof may be made therein without departing from thespirit and scope of the disclosure as defined by the following claims.

What is claimed is:
 1. A display device comprising: a substratecomprising a display area and a peripheral area outside the displayarea, the peripheral area comprising a flexible area, and the substratebeing flexible around a bending axis located in the flexible area andextending in one direction; a data line and a driving voltage linedisposed in the display area; an inorganic insulating layer on thesubstrate and which defines an opening corresponding to the flexiblearea; a first conductive layer and a second conductive layer disposed inthe peripheral area and which are spaced apart from each other aroundthe opening; an organic insulating layer which covers the firstconductive layer and the second conductive layer; and a connectionconductive layer on the organic insulating layer, wherein the connectionconductive layer connects the first conductive layer and the secondconductive layer via contact holes defined in the organic insulatinglayer, the first conductive layer and the second conductive layercomprises a same material as that of one of the data line and thedriving voltage line, and the connection conductive layer comprises asame material as that of the other of the data line and the drivingvoltage line.
 2. The display device of claim 1, wherein the firstconductive layer and the second conductive layer are disposed on theinorganic insulating layer.
 3. The display device of claim 1, wherein aportion of the organic insulating layer is disposed between the dataline and the driving voltage line.
 4. The display device of claim 1,further comprising a third conductive layer inside the opening and whichcomprises the same material as that of the first conductive layer andthe second conductive layer.
 5. The display device of claim 4, whereinthe connection conductive layer connects the third conductive layer viaa contact hole defined in the organic insulating layer.
 6. The displaydevice of claim 4, wherein the connection conductive layer comprises: afirst connection conductive layer which connects the first conductivelayer to the third conductive layer; and a second connection conductivelayer which connects the second conductive layer to the third conductivelayer, wherein the second connection conductive layer is spaced apartfrom the first connection conductive layer.
 7. The display device ofclaim 6, wherein the third conductive layer comprises a plurality ofsub-conductive layers spaced apart from each other inside the opening,and the connection conductive layer further comprises an additionalconnection conductive layer which connects adjacent sub-conductivelayers among the plurality of sub-conductive layers.
 8. The displaydevice of claim 1, further comprising an additional driving voltage linewhich overlaps at least a portion of the driving voltage line and isspaced apart from the driving voltage line and electrically connected tothe driving voltage line.
 9. The display device of claim 8, wherein theadditional driving voltage line comprises the same material as that ofthe data line.
 10. The display device of claim 1, wherein the substratecomprises a plastic layer, and at least a portion of the organicinsulating layer inside the opening directly contacts the plastic layerof the substrate.
 11. The display device of claim 10, wherein thesubstrate further comprises an inorganic barrier layer on the plasticlayer and which defines an opening corresponding to the opening of theinorganic insulating layer and exposing the plastic layer.
 12. A displaydevice comprising: a substrate comprising a display area and aperipheral area outside the display area, the peripheral area comprisinga flexible area; a thin film transistor disposed in the display area andwhich comprises a semiconductor layer and a gate electrode; an inorganicinsulating layer on the substrate and which covers the gate electrodeand defines an opening corresponding to the flexible area; a pixelelectrode disposed in the display area and which is connected to thethin film transistor; a first wiring layer and a second wiring layerdisposed in the display area and between the inorganic insulating layerand the pixel electrode; a first conductive layer and a secondconductive layer disposed in the peripheral area, spaced apart from eachother around the opening, and on the inorganic insulating layer; anorganic insulating layer which covers the first conductive layer and thesecond conductive layer; and a connection conductive layer on theorganic insulating layer and which connects the first conductive layerand the second conductive layer via contact holes respectively definedin the organic insulating layer, wherein the first conductive layer andthe second conductive layer comprises a same material as that of one ofthe first wiring layer and the second wiring layer, and the connectionconductive layer comprises a same material as that of the other of thefirst wiring layer and the second wiring layer.
 13. The display deviceof claim 12, wherein a portion of the organic insulating layer isdisposed between the first wiring layer and the second wiring layer. 14.The display device of claim 13, wherein the first wiring layer and thesecond wiring layer are connected to each other via a contact holedefined in the organic insulating layer.
 15. The display device of claim14, wherein the first wiring layer and the second wiring layerrespectively are an upper driving voltage line and a lower drivingvoltage line.
 16. The display device of claim 12, further comprising adata line and a driving voltage line in the display area and which areelectrically connected to the thin film transistor, wherein one of thefirst wiring layer and the second wiring layer is the data line, and theother of the first wiring layer and the second wiring layer is thedriving voltage line.
 17. The display device of claim 12, furthercomprising a third conductive layer inside the opening and whichcomprises the same material as that of the first conductive layer andthe second conductive layer.
 18. The display device of claim 17, whereinthe connection conductive layer connects the third conductive layer viaa contact hole defined in the organic insulating layer.
 19. The displaydevice of claim 18, wherein the connection conductive layer comprises aplurality of sub-connection conductive layers, and each of the pluralityof sub-connection conductive layers connects two adjacent conductivelayers among the first to third conductive layers.
 20. The displaydevice of claim 12, wherein the substrate comprises a plastic layer, andat least a portion of the organic insulating layer inside the openingdirectly contacts the plastic layer via the opening.